Setting

Global Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Region: Trend Forecast and Growth Opportunity

Published: 30 Jan 2022 | Report Code: 10248326 | Pages: 152

Global Advanced Packaging Market will reach $69.17 billion by 2031, growing by 10.0% annually over 2021-2031, driven by the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging. Highlighted with 79 tables and 74 figures, this 152-page report “Global Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Region: Trend Forecast and Growth Opportunity” is based on comprehensive research of the entire Global Advanced Packaging Market and all its sub-segments through extensively detailed classifications.

 

Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides a forecast from 2022 to 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

 

In-depth qualitative analyses include identification and investigation of the following aspects:

• Market Structure

• Growth Drivers

• Restraints and Challenges

• Emerging Product Trends & Market Opportunities

• Porter’s Five Forces

 

The trend and outlook of the global market are forecast in an optimistic, balanced, and conservative view by taking into account COVID-19. The balanced (most likely) projection is used to quantify the Global Advanced Packaging Market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Region.

 

Based on Product Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

• Active Packaging

• Smart and Intelligent Packaging

 

Based on Packaging Platform, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

• Flip-Chip Ball Grid Array

• Flip Chip CSP

• Wafer Level CSP

• 2.5D/3D Integrated Circuit

• Fan Out Wafer Level Package (Fo-WLP)

• Embedded Die

• Fan In Wafer Level Package (Fi-WLP)

• Other Packaging Platforms

 

By End User, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.

• Consumer Electronics

• IT and Telecom

• Automotive and Transportation

• Industrial Sector

• Healthcare and Life Science

• Aerospace and Defense

• Other End Users

 

Geographically, the following regions together with the listed national/local markets are fully investigated:

• North America (U.S., Canada, and Mexico)

• Europe (Germany, UK, France, Spain, Italy, Russia, Rest of Europe; Rest of Europe is further segmented into Netherlands, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)

• APAC (Japan, China, South Korea, Australia, India, and the Rest of APAC; the Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and the Philippines)

• South America (Brazil, Chile, Argentina, Rest of South America)

• MEA (Turkey, Iran, South Africa, Other Nations)

For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.

 

Selected Key Players:

Advanced Semiconductor Engineering Inc.

Amkor Technology, Inc.

Brewer Science, Inc.

Chipbond Technology Corporation

Intel Corporation

International Business Machines Corporation (IBM)

Microchip Technology, Inc.

Qualcomm Technologies, Inc.

Renesas Electronics Corporation

Samsung Electronics Co., Ltd.

STATS ChipPAC Pte. Ltd

SÜSS Microtec Se

Taiwan Semiconductor Manufacturing Company, Limited

Texas Instruments, Inc.

Universal Instruments Corporation

(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

Table Of Contents:

1 Introduction    8
1.1 Industry Definition and Research Scope    8
1.1.1 Industry Definition    8
1.1.2 Research Scope    9
1.2 Research Methodology    12
1.2.1 Overview of Market Research Methodology    12
1.2.2 Market Assumption    13
1.2.3 Secondary Data    13
1.2.4 Primary Data    13
1.2.5 Data Filtration and Model Design    14
1.2.6 Market Size/Share Estimation    15
1.2.7 Research Limitations    16
1.3 Executive Summary    17
2 Market Overview and Dynamics    20
2.1 Market Size and Forecast    20
2.1.1 Impact of COVID-19 on World Economy    21
2.1.2 Impact of COVID-19 on the Market    23
2.2 Major Growth Drivers    25
2.3 Market Restraints and Challenges    28
2.4 Emerging Opportunities and Market Trends    31
2.5 Porter’s Five Forces Analysis    35
3 Segmentation of Global Market by Product Type    39
3.1 Market Overview by Product Type    39
3.2 Active Packaging    41
3.3 Smart and Intelligent Packaging    42
4 Segmentation of Global Market by Packaging Platform    43
4.1 Market Overview by Packaging Platform    43
4.2 Flip-Chip Ball Grid Array    45
4.3 Flip Chip CSP    46
4.4 Wafer Level CSP    47
4.5 2.5D/3D Integrated Circuit    48
4.6 Fan Out Wafer Level Package (Fo-WLP)    49
4.7 Embedded Die    50
4.8 Fan In Wafer Level Package (Fi-WLP)    51
4.9 Other Packaging Platforms    52
5 Segmentation of Global Market by End User    53
5.1 Market Overview by End User    53
5.2 Consumer Electronics    55
5.3 IT and Telecom    56
5.4 Automotive and Transportation    57
5.5 Industrial Sector    58
5.6 Healthcare and Life Science    59
5.7 Aerospace and Defense    60
5.8 Other End Users    61
6 Segmentation of Global Market by Region    62
6.1 Geographic Market Overview 2021-2031    62
6.2 North America Market 2021-2031 by Country    66
6.2.1 Overview of North America Market    66
6.2.2 U.S.    70
6.2.3 Canada    73
6.2.4 Mexico    75
6.3 European Market 2021-2031 by Country    77
6.3.1 Overview of European Market    77
6.3.2 Germany    81
6.3.3 U.K.    83
6.3.4 France    85
6.3.5 Spain    87
6.3.6 Italy    89
6.3.7 Russia    91
6.3.8 Rest of European Market    93
6.4 Asia-Pacific Market 2021-2031 by Country    95
6.4.1 Overview of Asia-Pacific Market    95
6.4.2 Japan    99
6.4.3 China    102
6.4.4 Australia    104
6.4.5 India    106
6.4.6 South Korea    108
6.4.7 Rest of APAC Region    110
6.5 South America Market 2021-2031 by Country    112
6.5.1 Argentina    115
6.5.2 Brazil    117
6.5.3 Chile    119
6.5.4 Rest of South America Market    121
6.6 MEA Market 2021-2031 by Country    122
6.6.1 Turkey    125
6.6.2 Iran    127
6.6.3 South Africa    129
6.6.4 Other National Markets    131
7 Competitive Landscape    132
7.1 Overview of Key Vendors    132
7.2 New Product Launch, Partnership, Investment, and M&A    135
7.3 Company Profiles    136
Advanced Semiconductor Engineering Inc.    136
Amkor Technology, Inc.    138
Brewer Science, Inc.    139
Chipbond Technology Corporation    140
Intel Corporation    141
International Business Machines Corporation (IBM)    142
Microchip Technology, Inc.    143
Qualcomm Technologies, Inc.    144
Renesas Electronics Corporation    145
Samsung Electronics Co., Ltd.    146
STATS ChipPAC Pte. Ltd    147
SÜSS Microtec Se    148
Taiwan Semiconductor Manufacturing Company, Limited    149
Texas Instruments, Inc.    150
Universal Instruments Corporation    151
RELATED REPORTS    152

 

List Of Tables:

Table 1.  Snapshot of Global Advanced Packaging Market in Balanced Perspective, 2021-2031    18
Table 2. World Economic Outlook, 2021-2031    22
Table 3. World Electrical and Electronics Market, 2021-2031, $ bn    27
Table 4.  Main Product Trends and Market Opportunities in Global Advanced Packaging Market    31
Table 5. Global Advanced Packaging Market by Product Type, 2021-2031, $ mn    39
Table 6. Global Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    43
Table 7. Global Advanced Packaging Market by End User, 2021-2031, $ mn    53
Table 8. Global Advanced Packaging Market by Region, 2021-2031, $ mn    63
Table 9.  Leading National Advanced Packaging Market, 2021 and 2031, $ mn    65
Table 10. North America Advanced Packaging Market by Country, 2021-2031, $ mn    68
Table 11. U.S. Advanced Packaging Market by Product Type, 2021-2031, $ mn    72
Table 12. U.S. Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    72
Table 13. U.S. Advanced Packaging Market by End User, 2021-2031, $ mn    72
Table 14. Canada Advanced Packaging Market by Product Type, 2021-2031, $ mn    74
Table 15. Canada Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    74
Table 16. Canada Advanced Packaging Market by End User, 2021-2031, $ mn    74
Table 17. Mexico Advanced Packaging Market by Product Type, 2021-2031, $ mn    76
Table 18. Mexico Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    76
Table 19. Mexico Advanced Packaging Market by End User, 2021-2031, $ mn    76
Table 20. Europe Advanced Packaging Market by Country, 2021-2031, $ mn    80
Table 21. Germany Advanced Packaging Market by Product Type, 2021-2031, $ mn    82
Table 22. Germany Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    82
Table 23. Germany Advanced Packaging Market by End User, 2021-2031, $ mn    82
Table 24. U.K. Advanced Packaging Market by Product Type, 2021-2031, $ mn    84
Table 25. U.K. Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    84
Table 26. U.K. Advanced Packaging Market by End User, 2021-2031, $ mn    84
Table 27. France Advanced Packaging Market by Product Type, 2021-2031, $ mn    86
Table 28. France Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    86
Table 29. France Advanced Packaging Market by End User, 2021-2031, $ mn    86
Table 30. Spain Advanced Packaging Market by Product Type, 2021-2031, $ mn    88
Table 31. Spain Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    88
Table 32. Spain Advanced Packaging Market by End User, 2021-2031, $ mn    88
Table 33. Italy Advanced Packaging Market by Product Type, 2021-2031, $ mn    90
Table 34. Italy Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    90
Table 35. Italy Advanced Packaging Market by End User, 2021-2031, $ mn    90
Table 36. Russia Advanced Packaging Market by Product Type, 2021-2031, $ mn    92
Table 37. Russia Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    92
Table 38. Russia Advanced Packaging Market by End User, 2021-2031, $ mn    92
Table 39. Advanced Packaging Market in Rest of Europe by Country, 2021-2031, $ mn    94
Table 40. APAC Advanced Packaging Market by Country, 2021-2031, $ mn    97
Table 41. Japan Advanced Packaging Market by Product Type, 2021-2031, $ mn    101
Table 42. Japan Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    101
Table 43. Japan Advanced Packaging Market by End User, 2021-2031, $ mn    101
Table 44. China Advanced Packaging Market by Product Type, 2021-2031, $ mn    103
Table 45. China Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    103
Table 46. China Advanced Packaging Market by End User, 2021-2031, $ mn    103
Table 47. Australia Advanced Packaging Market by Product Type, 2021-2031, $ mn    105
Table 48. Australia Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    105
Table 49. Australia Advanced Packaging Market by End User, 2021-2031, $ mn    105
Table 50. India Advanced Packaging Market by Product Type, 2021-2031, $ mn    107
Table 51. India Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    107
Table 52. India Advanced Packaging Market by End User, 2021-2031, $ mn    107
Table 53. South Korea Advanced Packaging Market by Product Type, 2021-2031, $ mn    109
Table 54. South Korea Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    109
Table 55. South Korea Advanced Packaging Market by End User, 2021-2031, $ mn    109
Table 56. Advanced Packaging Market in Rest of APAC by Country/Region, 2021-2031, $ mn    111
Table 57. South America Advanced Packaging Market by Country, 2021-2031, $ mn    114
Table 58. Argentina Advanced Packaging Market by Product Type, 2021-2031, $ mn    116
Table 59. Argentina Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    116
Table 60. Argentina Advanced Packaging Market by End User, 2021-2031, $ mn    116
Table 61. Brazil Advanced Packaging Market by Product Type, 2021-2031, $ mn    118
Table 62. Brazil Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    118
Table 63. Brazil Advanced Packaging Market by End User, 2021-2031, $ mn    118
Table 64. Chile Advanced Packaging Market by Product Type, 2021-2031, $ mn    120
Table 65. Chile Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    120
Table 66. Chile Advanced Packaging Market by End User, 2021-2031, $ mn    120
Table 67. MEA Advanced Packaging Market by Country, 2021-2031, $ mn    124
Table 68. Turkey Advanced Packaging Market by Product Type, 2021-2031, $ mn    126
Table 69. Turkey Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    126
Table 70. Turkey Advanced Packaging Market by End User, 2021-2031, $ mn    126
Table 71. Iran Advanced Packaging Market by Product Type, 2021-2031, $ mn    128
Table 72. Iran Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    128
Table 73. Iran Advanced Packaging Market by End User, 2021-2031, $ mn    128
Table 74. South Africa Advanced Packaging Market by Product Type, 2021-2031, $ mn    130
Table 75. South Africa Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn    130
Table 76. South Africa Advanced Packaging Market by End User, 2021-2031, $ mn    130
Table 77. Advanced Semiconductor Engineering Inc.: Company Snapshot    136
Table 78. Advanced Semiconductor Engineering Inc.: Business Segmentation    137
Table 79. Advanced Semiconductor Engineering Inc.: Product Portfolio    137

 

List Of Figures:

Figure 1. Research Method Flow Chart    12
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation    15
Figure 3. Global Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031    17
Figure 4. Global Advanced Packaging Market, 2021-2031, $ mn    20
Figure 5. Impact of COVID-19 on Business    23
Figure 6. Primary Drivers and Impact Factors of Global Advanced Packaging Market    25
Figure 7. Primary Restraints and Impact Factors of Global Advanced Packaging Market    28
Figure 8. Investment Opportunity Analysis    32
Figure 9. Porter’s Fiver Forces Analysis of Global Advanced Packaging Market    35
Figure 10. Breakdown of Global Advanced Packaging Market by Product Type, 2021-2031, % of Revenue    40
Figure 11. Global Addressable Market Cap in 2022-2031 by Product Type, Value ($ mn) and Share (%)    40
Figure 12. Global Advanced Packaging Market by Product Type: Active Packaging, 2021-2031, $ mn    41
Figure 13. Global Advanced Packaging Market by Product Type: Smart and Intelligent Packaging, 2021-2031, $ mn    42
Figure 14. Breakdown of Global Advanced Packaging Market by Packaging Platform, 2021-2031, % of Sales Revenue    44
Figure 15. Global Addressable Market Cap in 2022-2031 by Packaging Platform, Value ($ mn) and Share (%)    44
Figure 16. Global Advanced Packaging Market by Packaging Platform: Flip-Chip Ball Grid Array, 2021-2031, $ mn    45
Figure 17. Global Advanced Packaging Market by Packaging Platform: Flip Chip CSP, 2021-2031, $ mn    46
Figure 18. Global Advanced Packaging Market by Packaging Platform: Wafer Level CSP, 2021-2031, $ mn    47
Figure 19. Global Advanced Packaging Market by Packaging Platform: 2.5D/3D Integrated Circuit, 2021-2031, $ mn    48
Figure 20. Global Advanced Packaging Market by Packaging Platform: Fan Out Wafer Level Package (Fo-WLP), 2021-2031, $ mn    49
Figure 21. Global Advanced Packaging Market by Packaging Platform: Embedded Die, 2021-2031, $ mn    50
Figure 22. Global Advanced Packaging Market by Packaging Platform: Fan In Wafer Level Package (Fi-WLP), 2021-2031, $ mn    51
Figure 23. Global Advanced Packaging Market by Packaging Platform: Other Packaging Platforms, 2021-2031, $ mn    52
Figure 24. Breakdown of Global Advanced Packaging Market by End User, 2021-2031, % of Sales Revenue    54
Figure 25. Global Addressable Market Cap in 2022-2031 by End User, Value ($ mn) and Share (%)    54
Figure 26. Global Advanced Packaging Market by End User: Consumer Electronics, 2021-2031, $ mn    55
Figure 27. Global Advanced Packaging Market by End User: IT and Telecom, 2021-2031, $ mn    56
Figure 28. Global Advanced Packaging Market by End User: Automotive and Transportation, 2021-2031, $ mn    57
Figure 29. Global Advanced Packaging Market by End User: Industrial Sector, 2021-2031, $ mn    58
Figure 30. Global Advanced Packaging Market by End User: Healthcare and Life Science, 2021-2031, $ mn    59
Figure 31. Global Advanced Packaging Market by End User: Aerospace and Defense, 2021-2031, $ mn    60
Figure 32. Global Advanced Packaging Market by End User: Other End Users, 2021-2031, $ mn    61
Figure 33.  Global Market Snapshot by Region    62
Figure 34.  Geographic Spread of Worldwide Advanced Packaging Market, 2021-2031, % of Sales Revenue    63
Figure 35. Global Addressable Market Cap in 2022-2031 by Region, Value ($ mn) and Share (%)    64
Figure 36.  North American Advanced Packaging Market, 2021-2031, $ mn    67
Figure 37. Breakdown of North America Advanced Packaging Market by Country, 2021 and 2031, % of Revenue    68
Figure 38. Contribution to North America 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%)    69
Figure 39. U.S. Advanced Packaging Market, 2021-2031, $ mn    71
Figure 40. Canada Advanced Packaging Market, 2021-2031, $ mn    73
Figure 41.  Advanced Packaging Market in Mexico, 2021-2031, $ mn    75
Figure 42.  European Advanced Packaging Market, 2021-2031, $ mn    78
Figure 43. Breakdown of European Advanced Packaging Market by Country, 2021 and 2031, % of Revenue    79
Figure 44. Contribution to Europe 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%)    80
Figure 45.  Advanced Packaging Market in Germany, 2021-2031, $ mn    81
Figure 46.  Advanced Packaging Market in U.K., 2021-2031, $ mn    83
Figure 47.  Advanced Packaging Market in France, 2021-2031, $ mn    85
Figure 48.  Advanced Packaging Market in Spain, 2021-2031, $ mn    87
Figure 49.  Advanced Packaging Market in Italy, 2021-2031, $ mn    89
Figure 50.  Advanced Packaging Market in Russia, 2021-2031, $ mn    91
Figure 51.  Advanced Packaging Market in Rest of Europe, 2021-2031, $ mn    93
Figure 52. Asia-Pacific Advanced Packaging Market, 2021-2031, $ mn    96
Figure 53. Breakdown of APAC Advanced Packaging Market by Country, 2021 and 2031, % of Revenue    96
Figure 54. Contribution to APAC 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%)    98
Figure 55.  Advanced Packaging Market in Japan, 2021-2031, $ mn    100
Figure 56.  Advanced Packaging Market in China, 2021-2031, $ mn    102
Figure 57.  Advanced Packaging Market in Australia, 2021-2031, $ mn    104
Figure 58.  Advanced Packaging Market in India, 2021-2031, $ mn    106
Figure 59.  Advanced Packaging Market in South Korea, 2021-2031, $ mn    108
Figure 60.  Advanced Packaging Market in Rest of APAC, 2021-2031, $ mn    110
Figure 61. South America Advanced Packaging Market, 2021-2031, $ mn    113
Figure 62. Breakdown of South America Advanced Packaging Market by Country, 2021 and 2031, % of Revenue    113
Figure 63. Contribution to South America 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%)    114
Figure 64.  Advanced Packaging Market in Argentina, 2021-2031, $ mn    115
Figure 65.  Advanced Packaging Market in Brazil, 2021-2031, $ mn    117
Figure 66.  Advanced Packaging Market in Chile, 2021-2031, $ mn    119
Figure 67.  Advanced Packaging Market in Rest of South America, 2021-2031, $ mn    121
Figure 68. Advanced Packaging Market in Middle East and Africa (MEA), 2021-2031, $ mn    123
Figure 69. Breakdown of MEA Advanced Packaging Market by Country, 2021 and 2031, % of Revenue    123
Figure 70. Contribution to MEA 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%)    124
Figure 71.  Advanced Packaging Market in Turkey, 2021-2031, $ mn    125
Figure 72.  Advanced Packaging Market in Iran, 2021-2031, $ mn    127
Figure 73.  Advanced Packaging Market in South Africa, 2021-2031, $ mn    129
Figure 74. Growth Stage of Global Advanced Packaging Industry over the Forecast Period    132
Key Players:
 
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SÜSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)