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Europe Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity

Published: 30 Apr 2023 | Report Code: 10248831 | Pages: 132

Europe Advanced IC Substrates Market was valued at $562.7 million in 2022 and will grow by 5.4% annually over 2022-2031, driven by the rising adoption of advanced substrates in the manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 61 tables and 50 figures, this 132-page report “Europe Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Europe Advanced IC Substrates Market and all its sub-segments through extensively detailed classifications.

 

Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

 

In-depth qualitative analyses include identification and investigation of the following aspects:
•  Market Structure 
•  Growth Drivers 
•  Restraints and Challenges
•  Emerging Product Trends & Market Opportunities
•  Porter’s Five Forces

 

The trend and outlook of Europe market is forecast in an optimistic, balanced, and conservative view by taking into account of COVID-19 and the Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe Advanced IC Substrates Market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. 

 

Based on Packaging Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. 
•  FC BGA
•  FC CSP
•  Other Packaging Types

 

Based on Material Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. 
•  Rigid Integrated Circuit Substrate
•  Flex Integrated Circuit Substrate
•  Ceramic Integrated Circuit Substrate

 

By Manufacturing Method, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. 
•  Subtraction Process (SP)
•  Addition Process (AP)
•  Modified Semi-additive Process (MSAP)

 

By Bonding Technology, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. 
•  Wire Bonding
•  FC Bonding
•  Tape Automated Bonding (TAB)

 

By Application, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. 
•  Mobile and Consumer Electronics
•  Automotive and Transportation
•  IT and Telecom
•  Other Applications

 

Geographically, the following national/local markets are fully investigated:
•  Germany
•  UK
•  France
•  Spain
•  Italy
•  Netherlands
•  Rest of Europe (further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) 

 

For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.

 

Selected Key Players: 
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor

 

(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

Table of Contents:

1 Introduction    8
1.1 Industry Definition and Research Scope    8
1.1.1 Industry Definition    8
1.1.2 Research Scope    9
1.2 Research Methodology    12
1.2.1 Overview of Market Research Methodology    12
1.2.2 Market Assumption    13
1.2.3 Secondary Data    13
1.2.4 Primary Data    13
1.2.5 Data Filtration and Model Design    14
1.2.6 Market Size/Share Estimation    15
1.2.7 Research Limitations    16
1.3 Executive Summary    17
2 Market Overview and Dynamics    20
2.1 Market Size and Forecast    20
2.1.1 Impact of COVID-19 on World Economy    22
2.1.2 Impact of COVID-19 on the Market    25
2.1.3 Impact of Russia-Ukraine Conflict: War Slows Economic Recovery    27
2.2 Major Growth Drivers    31
2.3 Market Restraints and Challenges    36
2.4 Emerging Opportunities and Market Trends    39
2.5 Porter’s Fiver Forces Analysis    43
3 Segmentation of Europe Market by Packaging Type    47
3.1 Market Overview by Packaging Type    47
3.2 FC BGA    49
3.3 FC CSP    50
3.4 Other Packaging Types    51
4 Segmentation of Europe Market by Material Type    52
4.1 Market Overview by Material Type    52
4.2 Rigid Integrated Circuit Substrate    54
4.3 Flex Integrated Circuit Substrate    55
4.4 Ceramic Integrated Circuit Substrate    56
5 Segmentation of Europe Market by Manufacturing Method    57
5.1 Market Overview by Manufacturing Method    57
5.2 Subtraction Process (SP)    59
5.3 Addition Process (AP)    60
5.4 Modified Semi-additive Process (MSAP)    61
6 Segmentation of Europe Market by Bonding Technology    62
6.1 Market Overview by Bonding Technology    62
6.2 Wire Bonding    64
6.3 FC Bonding    66
6.4 Tape Automated Bonding (TAB)    68
7 Segmentation of Europe Market by Application    69
7.1 Market Overview by Application    69
7.2 Mobile and Consumer Electronics    71
7.3 Automotive and Transportation    72
7.4 IT and Telecom    73
7.5 Other Applications    74
8 European Market 2021-2031 by Country    75
8.1 Overview of European Market    75
8.2 Germany    78
8.3 U.K.    80
8.4 France    82
8.5 Spain    84
8.6 Italy    86
8.7 Netherlands    88
8.8 Rest of European Market    90
9 Competitive Landscape    92
9.1 Overview of Key Vendors    92
9.2 New Product Launch, Partnership, Investment, and M&A    95
9.3 Company Profiles    96
ASE Group    96
AT&S Austria Technologie & Systemtechnik AG    98
Fujitsu Ltd.    101
IBIDEN Co., Ltd.    105
Kinsus Interconnect Technology Corp.    107
Korea Circuit Co., Ltd.    109
KYOCERA Corporation    110
LG Innotek Co., Ltd.    113
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)    114
Shenzhen Fastprint Circuit Tech    115
Shinko Electric Industries Co., Ltd.    116
Siliconware Precision Industries Co., Ltd.    119
STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD)    121
TTM Technologies Inc.    124
Unimicron Corporation    127
Zhen Ding Technology Holding Ltd.    130
Zhuhai ACCESS Semiconductor    131
RELATED REPORTS    132

 

List of Tables:

Table 1. Snapshot of Europe Advanced IC Substrates Market in Balanced Perspective, 2021-2031    18
Table 2. World Economic Outlook, 2021-2031    23
Table 3. World Economic Outlook, 2021-2023    24
Table 4. Scenarios for Economic Impact of Ukraine Crisis    28
Table 5. World Semiconductor Market, 2021-2031, $ bn    34
Table 6. Main Product Trends and Market Opportunities in Europe Advanced IC Substrates Market    39
Table 7. Europe Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn    47
Table 8. Europe Advanced IC Substrates Market by Material Type, 2021-2031, $ mn    52
Table 9. Europe Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn    57
Table 10. Europe Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn    62
Table 11. Europe Advanced IC Substrates Market by Application, 2021-2031, $ mn    69
Table 12. Europe Advanced IC Substrates Market by Country, 2021-2031, $ mn    77
Table 13. Germany Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn    79
Table 14. Germany Advanced IC Substrates Market by Material Type, 2021-2031, $ mn    79
Table 15. Germany Advanced IC Substrates Market by Application, 2021-2031, $ mn    79
Table 16. U.K. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn    81
Table 17. U.K. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn    81
Table 18. U.K. Advanced IC Substrates Market by Application, 2021-2031, $ mn    81
Table 19. France Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn    83
Table 20. France Advanced IC Substrates Market by Material Type, 2021-2031, $ mn    83
Table 21. France Advanced IC Substrates Market by Application, 2021-2031, $ mn    83
Table 22. Spain Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn    85
Table 23. Spain Advanced IC Substrates Market by Material Type, 2021-2031, $ mn    85
Table 24. Spain Advanced IC Substrates Market by Application, 2021-2031, $ mn    85
Table 25. Italy Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn    87
Table 26. Italy Advanced IC Substrates Market by Material Type, 2021-2031, $ mn    87
Table 27. Italy Advanced IC Substrates Market by Application, 2021-2031, $ mn    87
Table 28. Netherlands Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn    89
Table 29. Netherlands Advanced IC Substrates Market by Material Type, 2021-2031, $ mn    89
Table 30. Netherlands Advanced IC Substrates Market by Application, 2021-2031, $ mn    89
Table 31. Advanced IC Substrates Market in Rest of Europe by Country, 2021-2031, $ mn    91
Table 32. ASE Group: Company Snapshot    96
Table 33. ASE Group: Business Segmentation    97
Table 34. ASE Group: Product Portfolio    97
Table 35. AT&S Austria Technologie & Systemtechnik AG: Company Snapshot    98
Table 36. AT&S Austria Technologie & Systemtechnik AG: Breakdown of Revenue by Business Segment    99
Table 37. Fujitsu Limited: Company Snapshot    101
Table 38. Fujitsu Limited: Business Segmentation and Share    102
Table 39. Fujitsu Limited: Revenue Distribution by Region in 2021    103
Table 40. IBIDEN Co., Ltd.: Company Snapshot    105
Table 41. IBIDEN Co., Ltd.: Breakdown of Revenue by Business Segment    106
Table 42. Kinsus Interconnect Technology Corp..: Company Snapshot    107
Table 43. Kinsus Interconnect Technology Corp.: Breakdown of Revenue by Business Segment    108
Table 44. Korea Circuit Co., Ltd.: Company Snapshot    109
Table 45. KYOCERA Corporation: Company Snapshot    110
Table 46. KYOCERA Corporation: Breakdown of Revenue by Business Segment    111
Table 47. LG Innotek Co., Ltd.: Company Snapshot    113
Table 48. Nan Ya PCB Co., Ltd.: Company Snapshot    114
Table 49. Shenzhen Fastprint Circuit Tech: Company Snapshot    115
Table 50. Shinko Electric Industries Co., Ltd.: Company Snapshot    116
Table 51. Shinko Electric Industries Co., Ltd.: Breakdown of Revenue by Business Segment    117
Table 52. Siliconware Precision Industries Co., Ltd.: Company Snapshot    119
Table 53. Siliconware Precision Industries Co., Ltd.: Breakdown of Revenue by Business Segment    120
Table 54. STATS ChipPAC Pte. Ltd.: Company Snapshot    121
Table 55. STATS ChipPAC Pte. Ltd.: Breakdown of Revenue by Business Segment    122
Table 56. TTM Technologies Inc.: Company Snapshot    124
Table 57. TTM Technologies Inc.: Breakdown of Revenue by Business Segment    125
Table 58. Unimicron Corporation: Company Snapshot    127
Table 59. Unimicron Corporation: Breakdown of Revenue by Business Segment    128
Table 60. Zhen Ding Technology Holding Ltd.: Company Snapshot    130
Table 61. Zhuhai ACCESS Semiconductor: Company Snapshot    131
Selected Key Players: 
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor 
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)