Published: 30 Jan 2022 | Report Code: 10248329 | Pages: 97
Asia Pacific advanced packaging market will grow by 10.7% annually with a total addressable market cap of $338.4 billion over 2022-2031 owing to the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging. Highlighted with 27 tables and 41 figures, this 97-page report “Asia Pacific Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify Asia Pacific advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Country. Based on Product Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Active Packaging • Smart and Intelligent Packaging Based on Packaging Platform, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Flip-Chip Ball Grid Array • Flip Chip CSP • Wafer Level CSP • 2.5D/3D Integrated Circuit • Fan Out Wafer Level Package (Fo-WLP) • Embedded Die • Fan In Wafer Level Package (Fi-WLP) • Other Packaging Platforms By End User, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Consumer Electronics • IT and Telecom • Automotive and Transportation • Industrial Sector • Healthcare and Life Science • Aerospace and Defense • Other End Users Geographically, the following national/local markets are fully investigated: • Japan • China • South Korea • Australia • India • Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: Advanced Semiconductor Engineering Inc. Amkor Technology, Inc. Brewer Science, Inc. Chipbond Technology Corporation Intel Corporation International Business Machines Corporation (IBM) Microchip Technology, Inc. Qualcomm Technologies, Inc. Renesas Electronics Corporation Samsung Electronics Co., Ltd. STATS ChipPAC Pte. Ltd SÜSS Microtec Se Taiwan Semiconductor Manufacturing Company, Limited Texas Instruments, Inc. Universal Instruments Corporation (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
Table Of Contents:
1 Introduction 7 1.1 Industry Definition and Research Scope 7 1.1.1 Industry Definition 7 1.1.2 Research Scope 8 1.2 Research Methodology 11 1.2.1 Overview of Market Research Methodology 11 1.2.2 Market Assumption 12 1.2.3 Secondary Data 12 1.2.4 Primary Data 12 1.2.5 Data Filtration and Model Design 13 1.2.6 Market Size/Share Estimation 14 1.2.7 Research Limitations 15 1.3 Executive Summary 16 2 Market Overview and Dynamics 19 2.1 Market Size and Forecast 19 2.1.1 Impact of COVID-19 on World Economy 20 2.1.2 Impact of COVID-19 on the Market 22 2.2 Major Growth Drivers 24 2.3 Market Restraints and Challenges 27 2.4 Emerging Opportunities and Market Trends 30 2.5 Porter’s Fiver Forces Analysis 34 3 Segmentation of Asia Pacific Market by Product Type 38 3.1 Market Overview by Product Type 38 3.2 Active Packaging 40 3.3 Smart and Intelligent Packaging 41 4 Segmentation of Asia Pacific Market by Packaging Platform 42 4.1 Market Overview by Packaging Platform 42 4.2 Flip-Chip Ball Grid Array 44 4.3 Flip Chip CSP 45 4.4 Wafer Level CSP 46 4.5 2.5D/3D Integrated Circuit 47 4.6 Fan Out Wafer Level Package (Fo-WLP) 48 4.7 Embedded Die 49 4.8 Fan In Wafer Level Package (Fi-WLP) 50 4.9 Other Packaging Platforms 51 5 Segmentation of Asia Pacific Market by End User 52 5.1 Market Overview by End User 52 5.2 Consumer Electronics 54 5.3 IT and Telecom 55 5.4 Automotive and Transportation 56 5.5 Industrial Sector 57 5.6 Healthcare and Life Science 58 5.7 Aerospace and Defense 59 5.8 Other End Users 60 6 Asia-Pacific Market 2021-2031 by Country 61 6.1 Overview of Asia-Pacific Market 61 6.2 Japan 64 6.3 China 67 6.4 Australia 69 6.5 India 71 6.6 South Korea 73 6.7 Rest of APAC Region 75 7 Competitive Landscape 77 7.1 Overview of Key Vendors 77 7.2 New Product Launch, Partnership, Investment, and M&A 80 7.3 Company Profiles 81 Advanced Semiconductor Engineering Inc. 81 Amkor Technology, Inc. 83 Brewer Science, Inc. 84 Chipbond Technology Corporation 85 Intel Corporation 86 International Business Machines Corporation (IBM) 87 Microchip Technology, Inc. 88 Qualcomm Technologies, Inc. 89 Renesas Electronics Corporation 90 Samsung Electronics Co., Ltd. 91 STATS ChipPAC Pte. Ltd 92 SÜSS Microtec Se 93 Taiwan Semiconductor Manufacturing Company, Limited 94 Texas Instruments, Inc. 95 Universal Instruments Corporation 96 RELATED REPORTS 97
List Of Tables:
Table 1. Snapshot of Asia Pacific Advanced Packaging Market in Balanced Perspective, 2021-2031 17 Table 2. World Economic Outlook, 2021-2031 21 Table 3. World Electrical and Electronics Market, 2021-2031, $ bn 26 Table 4. Main Product Trends and Market Opportunities in Asia Pacific Advanced Packaging Market 30 Table 5. Asia Pacific Advanced Packaging Market by Product Type, 2021-2031, $ mn 38 Table 6. Asia Pacific Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 42 Table 7. Asia Pacific Advanced Packaging Market by End User, 2021-2031, $ mn 52 Table 8. APAC Advanced Packaging Market by Country, 2021-2031, $ mn 62 Table 9. Japan Advanced Packaging Market by Product Type, 2021-2031, $ mn 66 Table 10. Japan Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 66 Table 11. Japan Advanced Packaging Market by End User, 2021-2031, $ mn 66 Table 12. China Advanced Packaging Market by Product Type, 2021-2031, $ mn 68 Table 13. China Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 68 Table 14. China Advanced Packaging Market by End User, 2021-2031, $ mn 68 Table 15. Australia Advanced Packaging Market by Product Type, 2021-2031, $ mn 70 Table 16. Australia Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 70 Table 17. Australia Advanced Packaging Market by End User, 2021-2031, $ mn 70 Table 18. India Advanced Packaging Market by Product Type, 2021-2031, $ mn 72 Table 19. India Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 72 Table 20. India Advanced Packaging Market by End User, 2021-2031, $ mn 72 Table 21. South Korea Advanced Packaging Market by Product Type, 2021-2031, $ mn 74 Table 22. South Korea Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 74 Table 23. South Korea Advanced Packaging Market by End User, 2021-2031, $ mn 74 Table 24. Advanced Packaging Market in Rest of APAC by Country/Region, 2021-2031, $ mn 76 Table 25. Advanced Semiconductor Engineering Inc.: Company Snapshot 81 Table 26. Advanced Semiconductor Engineering Inc.: Business Segmentation 82 Table 27. Advanced Semiconductor Engineering Inc.: Product Portfolio 82
List Of Figures:
Figure 1. Research Method Flow Chart 11 Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 14 Figure 3. Asia Pacific Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031 16 Figure 4. Asia Pacific Advanced Packaging Market, 2021-2031, $ mn 19 Figure 5. Impact of COVID-19 on Business 22 Figure 6. Primary Drivers and Impact Factors of Asia Pacific Advanced Packaging Market 24 Figure 7. Primary Restraints and Impact Factors of Asia Pacific Advanced Packaging Market 27 Figure 8. Investment Opportunity Analysis 31 Figure 9. Porter’s Fiver Forces Analysis of Asia Pacific Advanced Packaging Market 34 Figure 10. Breakdown of Asia Pacific Advanced Packaging Market by Product Type, 2021-2031, % of Revenue 39 Figure 11. Asia Pacific Addressable Market Cap in 2022-2031 by Product Type, Value ($ mn) and Share (%) 39 Figure 12. Asia Pacific Advanced Packaging Market by Product Type: Active Packaging, 2021-2031, $ mn 40 Figure 13. Asia Pacific Advanced Packaging Market by Product Type: Smart and Intelligent Packaging, 2021-2031, $ mn 41 Figure 14. Breakdown of Asia Pacific Advanced Packaging Market by Packaging Platform, 2021-2031, % of Sales Revenue 43 Figure 15. Asia Pacific Addressable Market Cap in 2022-2031 by Packaging Platform, Value ($ mn) and Share (%) 43 Figure 16. Asia Pacific Advanced Packaging Market by Packaging Platform: Flip-Chip Ball Grid Array, 2021-2031, $ mn 44 Figure 17. Asia Pacific Advanced Packaging Market by Packaging Platform: Flip Chip CSP, 2021-2031, $ mn 45 Figure 18. Asia Pacific Advanced Packaging Market by Packaging Platform: Wafer Level CSP, 2021-2031, $ mn 46 Figure 19. Asia Pacific Advanced Packaging Market by Packaging Platform: 2.5D/3D Integrated Circuit, 2021-2031, $ mn 47 Figure 20. Asia Pacific Advanced Packaging Market by Packaging Platform: Fan Out Wafer Level Package (Fo-WLP), 2021-2031, $ mn 48 Figure 21. Asia Pacific Advanced Packaging Market by Packaging Platform: Embedded Die, 2021-2031, $ mn 49 Figure 22. Asia Pacific Advanced Packaging Market by Packaging Platform: Fan In Wafer Level Package (Fi-WLP), 2021-2031, $ mn 50 Figure 23. Asia Pacific Advanced Packaging Market by Packaging Platform: Other Packaging Platforms, 2021-2031, $ mn 51 Figure 24. Breakdown of Asia Pacific Advanced Packaging Market by End User, 2021-2031, % of Sales Revenue 53 Figure 25. Asia Pacific Addressable Market Cap in 2022-2031 by End User, Value ($ mn) and Share (%) 53 Figure 26. Asia Pacific Advanced Packaging Market by End User: Consumer Electronics, 2021-2031, $ mn 54 Figure 27. Asia Pacific Advanced Packaging Market by End User: IT and Telecom, 2021-2031, $ mn 55 Figure 28. Asia Pacific Advanced Packaging Market by End User: Automotive and Transportation, 2021-2031, $ mn 56 Figure 29. Asia Pacific Advanced Packaging Market by End User: Industrial Sector, 2021-2031, $ mn 57 Figure 30. Asia Pacific Advanced Packaging Market by End User: Healthcare and Life Science, 2021-2031, $ mn 58 Figure 31. Asia Pacific Advanced Packaging Market by End User: Aerospace and Defense, 2021-2031, $ mn 59 Figure 32. Asia Pacific Advanced Packaging Market by End User: Other End Users, 2021-2031, $ mn 60 Figure 33. Breakdown of APAC Advanced Packaging Market by Country, 2021 and 2031, % of Revenue 62 Figure 34. Contribution to APAC 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 63 Figure 35. Advanced Packaging Market in Japan, 2021-2031, $ mn 65 Figure 36. Advanced Packaging Market in China, 2021-2031, $ mn 67 Figure 37. Advanced Packaging Market in Australia, 2021-2031, $ mn 69 Figure 38. Advanced Packaging Market in India, 2021-2031, $ mn 71 Figure 39. Advanced Packaging Market in South Korea, 2021-2031, $ mn 73 Figure 40. Advanced Packaging Market in Rest of APAC, 2021-2031, $ mn 75 Figure 41. Growth Stage of Asia Pacific Advanced Packaging Industry over the Forecast Period 77
Key Players:
Advanced Semiconductor Engineering Inc. Amkor Technology, Inc. Brewer Science, Inc. Chipbond Technology Corporation Intel Corporation International Business Machines Corporation (IBM) Microchip Technology, Inc. Qualcomm Technologies, Inc. Renesas Electronics Corporation Samsung Electronics Co., Ltd. STATS ChipPAC Pte. Ltd SÜSS Microtec Se Taiwan Semiconductor Manufacturing Company, Limited Texas Instruments, Inc. Universal Instruments Corporation (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)